{"id":237924,"date":"2016-07-25T11:30:00","date_gmt":"2016-07-25T09:30:00","guid":{"rendered":"https:\/\/cms.galaxiemedia.fr\/tomshardware\/2016\/07\/25\/fin-de-la-loi-de-moore-la-finesse-de-gravure-bloquee-en-2021\/"},"modified":"2023-06-23T14:52:18","modified_gmt":"2023-06-23T12:52:18","slug":"fin-de-la-loi-de-moore-la-finesse-de-gravure-bloquee-en-2021","status":"publish","type":"post","link":"https:\/\/www.tomshardware.fr\/fin-de-la-loi-de-moore-la-finesse-de-gravure-bloquee-en-2021\/","title":{"rendered":"Fin de la loi de Moore : la finesse de gravure bloqu\u00e9e en 2021 ?"},"content":{"rendered":"<p><span class=\"imgContent imgCenter\"><span class=\"imgWrapperOutter\"><span class=\"imgWrapperInner\"><span class=\"iZoom\"><img alt=\"Image 1 : Fin de la loi de Moore : la finesse de gravure bloqu\u00e9e en 2021 ?\" decoding=\"async\" width=\"600\" height=\"450\" src=\"https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2016\/07\/072116itrschartv5-1469203116131-1-600x450.png\" class=\"attachment-purch-600 size-purch-600\" alt=\"\" \/><span class=\"imgCaption\">Credit : Erik Vrielink<\/span><\/span><\/span><\/span><\/span><\/p>\n<\/p>\n<div class=\"table-wrapper\"><table class=\"editorTblTable editorTblSize100 editorTblStyledefault\">\n<tbody>\n<tr>\n<td><strong>A lire aussi :<\/strong><br \/>&#8211; <a href=\"https:\/\/www.tomshardware.fr\/miniaturisation-des-transistors-et-agrandissement-des-wafers-comprendre-les-enjeux-technologiques\/\">Miniaturisation des transistors et agrandissement des wafers : comprendre les enjeux technologiques<\/a><\/td>\n<\/tr>\n<\/tbody>\n<\/table><\/div>\n<p>Tous les deux ans, la Semiconductor Industry Association (SIA) qui repr\u00e9sente les principaux fabricants de semi-conducteurs am\u00e9ricains, publie une feuille de route extr\u00eamement compl\u00e8te (elle couvre les composants, CPU, m\u00e9moires flash et DRAM, mais \u00e9galement les gros syst\u00e8mes, datacenters et autres produits IoT) pour les prochaines d\u00e9cennies. Cette ann\u00e9e, l\u2019<strong>International Technology Roadmap for Semiconductors (ITRS)<\/strong> \u2013 rebaptis\u00e9 \u00ab\u00a0ITRS 2.0\u00a0\u00bb pour l\u2019occasion \u2013 fixe les <strong>grandes lignes pour les 15 prochaines ann\u00e9es<\/strong>, avec d\u2019importants changements par rapport au pr\u00e9c\u00e9dent rapport de 2013, en particulier<strong> la fin annonc\u00e9e et dat\u00e9e de la \u00ab\u00a0Loi\u00a0\u00bb de Moore<\/strong>.<\/p>\n<\/p>\n<h3>La limite des 10 nm<\/h3>\n<\/p>\n<p>Alors que l\u2019industrie des semi-conducteurs s\u2019est fix\u00e9 depuis des d\u00e9cennies comme objectif de suivre la c\u00e9l\u00e8bre Loi de Moore, \u00e0 savoir doubler tous les deux ans \u00a0le nombre de transistors sur une surface donn\u00e9e, la limite physique de la r\u00e9duction de la finesse de gravure n\u00e9cessaire pour continuer \u00e0 miniaturiser ces transistors approche \u00e0 grand pas.<\/p>\n<\/p>\n<p><span class=\"imgContent imgCenter\"><span class=\"imgWrapperOutter\"><span class=\"imgWrapperInner\"><span class=\"iZoom\"><img alt=\"Image 2 : Fin de la loi de Moore : la finesse de gravure bloqu\u00e9e en 2021 ?\" decoding=\"async\" width=\"600\" height=\"345\" src=\"https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2016\/07\/image5-600x345.png\" class=\"attachment-purch-600 size-purch-600\" alt=\"\" \/><\/span><\/span><\/span><\/span><\/p>\n<\/p>\n<p>Alors que le rapport de 2013 estimait que la longueur de la grille d\u2019un transistor &#8211; et <a href=\"https:\/\/www.tomshardware.fr\/miniaturisation-des-transistors-et-agrandissement-des-wafers-comprendre-les-enjeux-technologiques\/\">non pas la finesse de gravure<\/a>, m\u00eame si ces deux valeurs sont li\u00e9es &#8211; continuerait \u00e0 diminuer jusqu\u2019\u00e0 5 nm en 2028, la SIA pr\u00e9dit d\u00e9sormais que <strong>cette m\u00eame mesure atteindra un plancher de 10 nm d\u00e8s 2021<\/strong>. C\u2019en sera alors termin\u00e9 de la diminution de la taille physique de la grille des transistors. Mais les industriels travaillent d\u00e9j\u00e0 sur l\u2019apr\u00e8s-2021\u00a0: VGAA (Vertical gate-all-around), LGAA (Lateral gate-all-around)\u2026 Il faudra d\u00e9sormais\u00a0\u00ab\u00a0penser\u00a0\u00bb en 3D pour am\u00e9liorer l\u2019int\u00e9gration de composants h\u00e9t\u00e9rog\u00e8nes\u00a0!<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Plus de 50 ans apr\u00e8s sa premi\u00e8re conjecture, Gordon Moore continue de diriger (indirectement) l\u2019am\u00e9lioration de la densit\u00e9 de transistors sur une puce de silicium. Mais sa c\u00e9l\u00e8bre \u00ab Loi \u00bb va droit dans le\u2026<\/p>","protected":false},"author":9,"featured_media":230038,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"ep_exclude_from_search":false,"footnotes":""},"categories":[487,4071],"tags":[],"hubs":[],"acf":{"post_show_excerpt":true,"post_source":{"title":"Semiconductors.org","url":"http:\/\/www.semiconductors.org\/news\/2016\/07\/08\/press_releases_2015\/international_technology_roadmap_for_semiconductors_examines_next_15_years_of_chip_innovation\/","target":""}},"yoast_head":"<!-- This site is optimized with the Yoast SEO Premium plugin v21.5 (Yoast SEO v22.5) - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>Fin de la loi de Moore : la finesse de gravure bloqu\u00e9e en 2021 ?<\/title>\n<meta name=\"description\" content=\"Plus de 50 ans apr\u00e8s sa premi\u00e8re conjecture, Gordon Moore continue de diriger (indirectement) l\u2019am\u00e9lioration de la densit\u00e9 de transistors sur une puce de silicium. 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Je suis bloqu\u00e9 au XXi\u00e8me si\u00e8cle c\u00f4t\u00e9 gaming : Doom et Duke Nukem 3D, tous les autres ne sont qu'erstaz.","sameAs":["https:\/\/www.facebook.com\/3pi141592653589793","https:\/\/www.linkedin.com\/in\/cgs3141592653589793\/","https:\/\/x.com\/___CgS___","https:\/\/fr.wikipedia.org\/wiki\/Utilisateur:Cgsyannick"],"url":"https:\/\/www.tomshardware.fr\/author\/yannick-guerrini\/"}]}},"_links":{"self":[{"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/posts\/237924"}],"collection":[{"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/users\/9"}],"replies":[{"embeddable":true,"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/comments?post=237924"}],"version-history":[{"count":0,"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/posts\/237924\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/media\/230038"}],"wp:attachment":[{"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/media?parent=237924"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/categories?post=237924"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/tags?post=237924"},{"taxonomy":"hubs","embeddable":true,"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/hubs?post=237924"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}