{"id":536200,"date":"2019-07-10T12:37:01","date_gmt":"2019-07-10T10:37:01","guid":{"rendered":"https:\/\/www.tomshardware.fr\/?p=536200"},"modified":"2023-06-22T17:51:52","modified_gmt":"2023-06-22T15:51:52","slug":"video-intel-montre-ses-innovations-concernant-emib-et-foveros","status":"publish","type":"post","link":"https:\/\/www.tomshardware.fr\/video-intel-montre-ses-innovations-concernant-emib-et-foveros\/","title":{"rendered":"Vid\u00e9o : Intel montre ses innovations concernant EMIB et Foveros"},"content":{"rendered":"\n\n\n\n\n<p>Lors de la Semicon qui se d\u00e9roule actuellement \u00e0 San Francisco, Intel a pr\u00e9sent\u00e9 les mises \u00e0 jour apport\u00e9es sur ses <a href=\"https:\/\/www.tomshardware.fr\/intel-fonce-sur-la-gravure-en-7-nm-prevue-pour-2021\/\">technologies EMIB et Foveros<\/a>. Pour rappel, Forevos permet l\u2019empilement 3D. L\u2019EMIB (<em>Embedded Multi-Die Interconnect Bridge)<\/em> est une couche d\u2019interconnexion qui relie les dies d\u2019un m\u00eame package entre eux. L\u2019entreprise a \u00e9galement pr\u00e9sent\u00e9 une nouvelle technologie ODI (<em>Omni-Directional Interconnect<\/em>).<br><\/p>\n\n\n\n<div class=\"table-wrapper\"><table class=\"wp-block-table\"><tbody><tr><td><strong>\u00c0 lire aussi :<\/strong> AMD : des processeurs empil\u00e9s refroidis gr\u00e2ce \u00e0 l\u2019effet Peltier ?<\/td><\/tr><\/tbody><\/table><\/div>\n\n\n\n<h2 class=\"wp-block-heading\">Des TSV plus larges<br><\/h2>\n\n\n\n<div class=\"wp-block-image\"><figure class=\"alignright\"><a href=\"https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2019\/07\/semitech-2x1-690x345.jpg\"><img alt=\"Image 1 : Vid\u00e9o : Intel montre ses innovations concernant EMIB et Foveros\" decoding=\"async\" width=\"300\" height=\"150\" src=\"https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2019\/07\/semitech-2x1-690x345-300x150.jpg\" alt=\"\" class=\"wp-image-536202\" srcset=\"https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2019\/07\/semitech-2x1-690x345-300x150.jpg 300w, https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2019\/07\/semitech-2x1-690x345-150x75.jpg 150w, https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2019\/07\/semitech-2x1-690x345-200x100.jpg 200w, https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2019\/07\/semitech-2x1-690x345-250x125.jpg 250w, https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2019\/07\/semitech-2x1-690x345-350x175.jpg 350w, https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2019\/07\/semitech-2x1-690x345-400x200.jpg 400w, https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2019\/07\/semitech-2x1-690x345-450x225.jpg 450w, https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2019\/07\/semitech-2x1-690x345-500x250.jpg 500w, https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2019\/07\/semitech-2x1-690x345-550x275.jpg 550w, https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2019\/07\/semitech-2x1-690x345-600x300.jpg 600w, https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2019\/07\/semitech-2x1-690x345-640x320.jpg 640w, https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2019\/07\/semitech-2x1-690x345.jpg 690w\" sizes=\"(max-width: 300px) 100vw, 300px\" \/><\/a><\/figure><\/div>\n\n\n\n<p>Cette nouvelle interconnexion omnidirectionnelle offre plus de flexibilit\u00e9 pour la communication entre les puces d&#8217;un m\u00eame package. La communication horizontale fonctionne comme dans l&#8217;EMIB. Mais les \u00e9changes se font aussi verticalement gr\u00e2ce au TSV (<em>Through Silicon Via<\/em>). Cette ODI utilise de larges vias verticaux pour permettre l&#8217;alimentation des parties sup\u00e9rieures directement depuis la base du substrat. Beaucoup plus larges que dans les TSV traditionnels, ces grands vias offrent une r\u00e9sistance plus faible, plus de bande passante, tout en \u00e9tant plus robustes. Par cons\u00e9quent, leur nombre est moindre. Ainsi, cela autorise une meilleure optimisation et lib\u00e8re plus d&#8217;espace pour les transistors.<br><\/p>\n\n\n\n\n\n\n\n<p>Intel a \u00e9galement pr\u00e9sent\u00e9 une nouvelle interface die-to-die MDIO (<em>Management Data Input\/Output<\/em>). En plus d\u2019une meilleure efficacit\u00e9 \u00e9nerg\u00e9tique, elle double la vitesse des broches et la densit\u00e9 de bande passant par rapport \u00e0 l\u2019AIB (<em>Advanced Interface Bus<\/em>).<\/p>\n\n\n\n<p>Babak Sabi, vice-pr\u00e9sident du d\u00e9veloppement chez Intel, a d\u00e9clar\u00e9 : &#8220;<em>Notre vision est de d\u00e9velopper une technologie de pointe pour connecter les puces et les chiplets dans un ensemble qui correspond \u00e0 la fonctionnalit\u00e9 d&#8217;un syst\u00e8me monolithique sur puce. Une approche h\u00e9t\u00e9rog\u00e8ne donne \u00e0 nos architectes une flexibilit\u00e9 sans pr\u00e9c\u00e9dent pour m\u00e9langer et faire correspondre des blocs IP et des technologies de traitement avec divers \u00e9l\u00e9ments de m\u00e9moire et d&#8217;E\/S dans des dispositifs avec de nouveaux facteurs de forme. La structure verticalement int\u00e9gr\u00e9e d&#8217;Intel offre un avantage \u00e0 l&#8217;\u00e8re de l&#8217;int\u00e9gration h\u00e9t\u00e9rog\u00e8ne. Elle nous permet une co-optimisation de l&#8217;architecture, des processus et du packaging pour fournir des produits de premier plan&#8221;<\/em>.<\/p>\n\n\n\n<div class=\"wp-block-image\"><figure class=\"aligncenter\"><a href=\"https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2019\/07\/attd-semicon-poster-768x999.png\"><img alt=\"Image 2 : Vid\u00e9o : Intel montre ses innovations concernant EMIB et Foveros\" decoding=\"async\" width=\"768\" height=\"999\" src=\"https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2019\/07\/attd-semicon-poster-768x999.png\" alt=\"\" class=\"wp-image-536203\" srcset=\"https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2019\/07\/attd-semicon-poster-768x999.png 768w, https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2019\/07\/attd-semicon-poster-768x999-231x300.png 231w, https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2019\/07\/attd-semicon-poster-768x999-150x195.png 150w, https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2019\/07\/attd-semicon-poster-768x999-200x260.png 200w, https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2019\/07\/attd-semicon-poster-768x999-250x325.png 250w, https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2019\/07\/attd-semicon-poster-768x999-300x390.png 300w, https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2019\/07\/attd-semicon-poster-768x999-350x455.png 350w, https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2019\/07\/attd-semicon-poster-768x999-400x520.png 400w, https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2019\/07\/attd-semicon-poster-768x999-450x585.png 450w, https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2019\/07\/attd-semicon-poster-768x999-500x650.png 500w, https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2019\/07\/attd-semicon-poster-768x999-550x715.png 550w, https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2019\/07\/attd-semicon-poster-768x999-600x780.png 600w, https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2019\/07\/attd-semicon-poster-768x999-640x833.png 640w, https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2019\/07\/attd-semicon-poster-768x999-710x924.png 710w, https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2019\/07\/attd-semicon-poster-768x999-755x982.png 755w\" sizes=\"(max-width: 768px) 100vw, 768px\" \/><\/a><\/figure><\/div>\n","protected":false},"excerpt":{"rendered":"<p>L\u2019avenir est \u00e0 l\u2019empilement 3D.<\/p>","protected":false},"author":82,"featured_media":536202,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"ep_exclude_from_search":false,"footnotes":""},"categories":[487,4071],"tags":[493],"hubs":[],"acf":{"display_mode":"medium-img","post_show_excerpt":true,"post_source":{"title":"Intel","url":"https:\/\/newsroom.intel.com\/news\/intel-unveils-new-tools-advanced-chip-packaging-toolbox\/#gs.o2zqm2","target":"_blank"},"hide_sidebar":false,"hide_advertising":false},"yoast_head":"<!-- This site is optimized with the Yoast SEO Premium plugin v21.5 (Yoast SEO v22.5) - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>Vid\u00e9o : Intel montre ses innovations concernant EMIB et Foveros<\/title>\n<meta name=\"description\" content=\"L\u2019avenir est \u00e0 l\u2019empilement 3D.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.tomshardware.fr\/video-intel-montre-ses-innovations-concernant-emib-et-foveros\/\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Vid\u00e9o : Intel montre ses innovations concernant EMIB et Foveros\" \/>\n<meta property=\"og:description\" content=\"L\u2019avenir est \u00e0 l\u2019empilement 3D.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.tomshardware.fr\/video-intel-montre-ses-innovations-concernant-emib-et-foveros\/\" \/>\n<meta property=\"og:site_name\" content=\"Tom\u2019s Hardware\" \/>\n<meta property=\"article:publisher\" content=\"https:\/\/www.facebook.com\/TomsHardwareFrance\/\" \/>\n<meta property=\"article:published_time\" content=\"2019-07-10T10:37:01+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2023-06-22T15:51:52+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2019\/07\/semitech-2x1-690x345.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"690\" \/>\n\t<meta property=\"og:image:height\" content=\"345\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"David Corroy\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:creator\" content=\"@malibard\" \/>\n<meta name=\"twitter:site\" content=\"@tomshardware_fr\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\/\/www.tomshardware.fr\/video-intel-montre-ses-innovations-concernant-emib-et-foveros\/#article\",\"isPartOf\":{\"@id\":\"https:\/\/www.tomshardware.fr\/video-intel-montre-ses-innovations-concernant-emib-et-foveros\/\"},\"author\":{\"name\":\"David Corroy\",\"@id\":\"https:\/\/www.tomshardware.fr\/#\/schema\/person\/7e879b8ff19551713f6055fd98dccf18\"},\"headline\":\"Vid\u00e9o : Intel montre ses innovations concernant EMIB et Foveros\",\"datePublished\":\"2019-07-10T10:37:01+00:00\",\"dateModified\":\"2023-06-22T15:51:52+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\/\/www.tomshardware.fr\/video-intel-montre-ses-innovations-concernant-emib-et-foveros\/\"},\"wordCount\":378,\"commentCount\":1,\"publisher\":{\"@id\":\"https:\/\/www.tomshardware.fr\/#organization\"},\"image\":{\"@id\":\"https:\/\/www.tomshardware.fr\/video-intel-montre-ses-innovations-concernant-emib-et-foveros\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2019\/07\/semitech-2x1-690x345.jpg\",\"keywords\":[\"Intel\"],\"articleSection\":[\"Actualit\u00e9\",\"Processeurs\"],\"inLanguage\":\"fr-FR\",\"potentialAction\":[{\"@type\":\"CommentAction\",\"name\":\"Comment\",\"target\":[\"https:\/\/www.tomshardware.fr\/video-intel-montre-ses-innovations-concernant-emib-et-foveros\/#respond\"]}]},{\"@type\":\"WebPage\",\"@id\":\"https:\/\/www.tomshardware.fr\/video-intel-montre-ses-innovations-concernant-emib-et-foveros\/\",\"url\":\"https:\/\/www.tomshardware.fr\/video-intel-montre-ses-innovations-concernant-emib-et-foveros\/\",\"name\":\"Vid\u00e9o : Intel montre ses innovations concernant EMIB et Foveros\",\"isPartOf\":{\"@id\":\"https:\/\/www.tomshardware.fr\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\/\/www.tomshardware.fr\/video-intel-montre-ses-innovations-concernant-emib-et-foveros\/#primaryimage\"},\"image\":{\"@id\":\"https:\/\/www.tomshardware.fr\/video-intel-montre-ses-innovations-concernant-emib-et-foveros\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2019\/07\/semitech-2x1-690x345.jpg\",\"datePublished\":\"2019-07-10T10:37:01+00:00\",\"dateModified\":\"2023-06-22T15:51:52+00:00\",\"description\":\"L\u2019avenir est \u00e0 l\u2019empilement 3D.\",\"inLanguage\":\"fr-FR\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/www.tomshardware.fr\/video-intel-montre-ses-innovations-concernant-emib-et-foveros\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"fr-FR\",\"@id\":\"https:\/\/www.tomshardware.fr\/video-intel-montre-ses-innovations-concernant-emib-et-foveros\/#primaryimage\",\"url\":\"https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2019\/07\/semitech-2x1-690x345.jpg\",\"contentUrl\":\"https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2019\/07\/semitech-2x1-690x345.jpg\",\"width\":690,\"height\":345},{\"@type\":\"WebSite\",\"@id\":\"https:\/\/www.tomshardware.fr\/#website\",\"url\":\"https:\/\/www.tomshardware.fr\/\",\"name\":\"Tom\u2019s Hardware\",\"description\":\"Toute l&#039;info hardware et gaming !\",\"publisher\":{\"@id\":\"https:\/\/www.tomshardware.fr\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\/\/www.tomshardware.fr\/?s={search_term_string}\"},\"query-input\":\"required name=search_term_string\"}],\"inLanguage\":\"fr-FR\"},{\"@type\":\"Organization\",\"@id\":\"https:\/\/www.tomshardware.fr\/#organization\",\"name\":\"Tom\u2019s Hardware\",\"url\":\"https:\/\/www.tomshardware.fr\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"fr-FR\",\"@id\":\"https:\/\/www.tomshardware.fr\/#\/schema\/logo\/image\/\",\"url\":\"https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2023\/06\/th.png\",\"contentUrl\":\"https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2023\/06\/th.png\",\"width\":1000,\"height\":1000,\"caption\":\"Tom\u2019s Hardware\"},\"image\":{\"@id\":\"https:\/\/www.tomshardware.fr\/#\/schema\/logo\/image\/\"},\"sameAs\":[\"https:\/\/www.facebook.com\/TomsHardwareFrance\/\",\"https:\/\/x.com\/tomshardware_fr\"]},{\"@type\":\"Person\",\"@id\":\"https:\/\/www.tomshardware.fr\/#\/schema\/person\/7e879b8ff19551713f6055fd98dccf18\",\"name\":\"David Corroy\",\"image\":{\"@type\":\"ImageObject\",\"inLanguage\":\"fr-FR\",\"@id\":\"https:\/\/www.tomshardware.fr\/#\/schema\/person\/image\/\",\"url\":\"https:\/\/secure.gravatar.com\/avatar\/a08bb358c2a9fc36265e8f3225c5de08?s=64&d=mm&r=g\",\"contentUrl\":\"https:\/\/secure.gravatar.com\/avatar\/a08bb358c2a9fc36265e8f3225c5de08?s=64&d=mm&r=g\",\"caption\":\"David Corroy\"},\"description\":\"Passionn\u00e9 par l'univers du num\u00e9rique et fondateur des plateformes influentes Phonandroid, PaperGeekFr et PlusDeBonsPlans, je suis un geek de la premi\u00e8re heure depuis 1998 et un expert en SEO depuis 2004. Mon parcours refl\u00e8te mon engagement pour l'innovation et ma qu\u00eate constante d'optimisation dans le domaine du seo et de l\u2019intelligence artificielle\",\"sameAs\":[\"https:\/\/www.linkedin.com\/in\/bernard-david-corroy\/\",\"https:\/\/x.com\/malibard\"],\"url\":\"https:\/\/www.tomshardware.fr\/author\/david\/\"}]}<\/script>\n<!-- \/ Yoast SEO Premium plugin. -->","yoast_head_json":{"title":"Vid\u00e9o : Intel montre ses innovations concernant EMIB et Foveros","description":"L\u2019avenir est \u00e0 l\u2019empilement 3D.","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.tomshardware.fr\/video-intel-montre-ses-innovations-concernant-emib-et-foveros\/","og_locale":"fr_FR","og_type":"article","og_title":"Vid\u00e9o : Intel montre ses innovations concernant EMIB et Foveros","og_description":"L\u2019avenir est \u00e0 l\u2019empilement 3D.","og_url":"https:\/\/www.tomshardware.fr\/video-intel-montre-ses-innovations-concernant-emib-et-foveros\/","og_site_name":"Tom\u2019s Hardware","article_publisher":"https:\/\/www.facebook.com\/TomsHardwareFrance\/","article_published_time":"2019-07-10T10:37:01+00:00","article_modified_time":"2023-06-22T15:51:52+00:00","og_image":[{"width":690,"height":345,"url":"https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2019\/07\/semitech-2x1-690x345.jpg","type":"image\/jpeg"}],"author":"David Corroy","twitter_card":"summary_large_image","twitter_creator":"@malibard","twitter_site":"@tomshardware_fr","schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.tomshardware.fr\/video-intel-montre-ses-innovations-concernant-emib-et-foveros\/#article","isPartOf":{"@id":"https:\/\/www.tomshardware.fr\/video-intel-montre-ses-innovations-concernant-emib-et-foveros\/"},"author":{"name":"David Corroy","@id":"https:\/\/www.tomshardware.fr\/#\/schema\/person\/7e879b8ff19551713f6055fd98dccf18"},"headline":"Vid\u00e9o : Intel montre ses innovations concernant EMIB et Foveros","datePublished":"2019-07-10T10:37:01+00:00","dateModified":"2023-06-22T15:51:52+00:00","mainEntityOfPage":{"@id":"https:\/\/www.tomshardware.fr\/video-intel-montre-ses-innovations-concernant-emib-et-foveros\/"},"wordCount":378,"commentCount":1,"publisher":{"@id":"https:\/\/www.tomshardware.fr\/#organization"},"image":{"@id":"https:\/\/www.tomshardware.fr\/video-intel-montre-ses-innovations-concernant-emib-et-foveros\/#primaryimage"},"thumbnailUrl":"https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2019\/07\/semitech-2x1-690x345.jpg","keywords":["Intel"],"articleSection":["Actualit\u00e9","Processeurs"],"inLanguage":"fr-FR","potentialAction":[{"@type":"CommentAction","name":"Comment","target":["https:\/\/www.tomshardware.fr\/video-intel-montre-ses-innovations-concernant-emib-et-foveros\/#respond"]}]},{"@type":"WebPage","@id":"https:\/\/www.tomshardware.fr\/video-intel-montre-ses-innovations-concernant-emib-et-foveros\/","url":"https:\/\/www.tomshardware.fr\/video-intel-montre-ses-innovations-concernant-emib-et-foveros\/","name":"Vid\u00e9o : Intel montre ses innovations concernant EMIB et Foveros","isPartOf":{"@id":"https:\/\/www.tomshardware.fr\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.tomshardware.fr\/video-intel-montre-ses-innovations-concernant-emib-et-foveros\/#primaryimage"},"image":{"@id":"https:\/\/www.tomshardware.fr\/video-intel-montre-ses-innovations-concernant-emib-et-foveros\/#primaryimage"},"thumbnailUrl":"https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2019\/07\/semitech-2x1-690x345.jpg","datePublished":"2019-07-10T10:37:01+00:00","dateModified":"2023-06-22T15:51:52+00:00","description":"L\u2019avenir est \u00e0 l\u2019empilement 3D.","inLanguage":"fr-FR","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.tomshardware.fr\/video-intel-montre-ses-innovations-concernant-emib-et-foveros\/"]}]},{"@type":"ImageObject","inLanguage":"fr-FR","@id":"https:\/\/www.tomshardware.fr\/video-intel-montre-ses-innovations-concernant-emib-et-foveros\/#primaryimage","url":"https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2019\/07\/semitech-2x1-690x345.jpg","contentUrl":"https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2019\/07\/semitech-2x1-690x345.jpg","width":690,"height":345},{"@type":"WebSite","@id":"https:\/\/www.tomshardware.fr\/#website","url":"https:\/\/www.tomshardware.fr\/","name":"Tom\u2019s Hardware","description":"Toute l&#039;info hardware et gaming !","publisher":{"@id":"https:\/\/www.tomshardware.fr\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.tomshardware.fr\/?s={search_term_string}"},"query-input":"required name=search_term_string"}],"inLanguage":"fr-FR"},{"@type":"Organization","@id":"https:\/\/www.tomshardware.fr\/#organization","name":"Tom\u2019s Hardware","url":"https:\/\/www.tomshardware.fr\/","logo":{"@type":"ImageObject","inLanguage":"fr-FR","@id":"https:\/\/www.tomshardware.fr\/#\/schema\/logo\/image\/","url":"https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2023\/06\/th.png","contentUrl":"https:\/\/www.tomshardware.fr\/content\/uploads\/sites\/3\/2023\/06\/th.png","width":1000,"height":1000,"caption":"Tom\u2019s Hardware"},"image":{"@id":"https:\/\/www.tomshardware.fr\/#\/schema\/logo\/image\/"},"sameAs":["https:\/\/www.facebook.com\/TomsHardwareFrance\/","https:\/\/x.com\/tomshardware_fr"]},{"@type":"Person","@id":"https:\/\/www.tomshardware.fr\/#\/schema\/person\/7e879b8ff19551713f6055fd98dccf18","name":"David Corroy","image":{"@type":"ImageObject","inLanguage":"fr-FR","@id":"https:\/\/www.tomshardware.fr\/#\/schema\/person\/image\/","url":"https:\/\/secure.gravatar.com\/avatar\/a08bb358c2a9fc36265e8f3225c5de08?s=64&d=mm&r=g","contentUrl":"https:\/\/secure.gravatar.com\/avatar\/a08bb358c2a9fc36265e8f3225c5de08?s=64&d=mm&r=g","caption":"David Corroy"},"description":"Passionn\u00e9 par l'univers du num\u00e9rique et fondateur des plateformes influentes Phonandroid, PaperGeekFr et PlusDeBonsPlans, je suis un geek de la premi\u00e8re heure depuis 1998 et un expert en SEO depuis 2004. Mon parcours refl\u00e8te mon engagement pour l'innovation et ma qu\u00eate constante d'optimisation dans le domaine du seo et de l\u2019intelligence artificielle","sameAs":["https:\/\/www.linkedin.com\/in\/bernard-david-corroy\/","https:\/\/x.com\/malibard"],"url":"https:\/\/www.tomshardware.fr\/author\/david\/"}]}},"_links":{"self":[{"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/posts\/536200"}],"collection":[{"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/users\/82"}],"replies":[{"embeddable":true,"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/comments?post=536200"}],"version-history":[{"count":0,"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/posts\/536200\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/media\/536202"}],"wp:attachment":[{"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/media?parent=536200"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/categories?post=536200"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/tags?post=536200"},{"taxonomy":"hubs","embeddable":true,"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/hubs?post=536200"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}