{"id":679202,"date":"2021-08-23T13:40:00","date_gmt":"2021-08-23T11:40:00","guid":{"rendered":"https:\/\/www.tomshardware.fr\/?p=679202"},"modified":"2023-06-22T17:08:48","modified_gmt":"2023-06-22T15:08:48","slug":"samsung-detaille-son-module-memoire-ddr5-7200-de-512-go","status":"publish","type":"post","link":"https:\/\/www.tomshardware.fr\/samsung-detaille-son-module-memoire-ddr5-7200-de-512-go\/","title":{"rendered":"Samsung d\u00e9taille son module m\u00e9moire DDR5-7200 de 512 Go"},"content":{"rendered":"\n

En mars dernier, Samsung annon\u00e7ait le d\u00e9veloppement d\u2019une barrette m\u00e9moire DDR5 de 512 Go<\/a>. Le communiqu\u00e9 de la firme cor\u00e9enne \u00e9tait cependant assez avare en d\u00e9tails. Il mentionnait simplement une vitesse de 7200 Mbit\/s et l\u2019empilement de 8 couches de puces DRAM de 16 Gb gr\u00e2ce \u00e0 des interconnexions TSV (Through Silicon Via). \u00c0 l\u2019occasion de la Hot Chips 33, Samsung a livr\u00e9 quelques diapositives suppl\u00e9mentaires.<\/p>\n\n\n\n

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Celles-ci ont \u00e9t\u00e9 partag\u00e9es par ComputerBase<\/a>. La premi\u00e8re diapositive met en avant la hausse des performances, de la bande passante et des capacit\u00e9s\u00a0; les deux autres exposent les am\u00e9liorations structurelles. Ces derni\u00e8res montrent par exemple que Samsung a r\u00e9ussi \u00e0 empiler huit couches de puces DDR5 (8H) contre quatre puces DDR4 jusqu\u2019ici (4H). Malgr\u00e9 cela, une r\u00e9duction de 40\u00a0% de l\u2019espace entre les puces permet de r\u00e9duire la hauteur de l\u2019empilement \u00e0 1 mm contre 1,2 mm pour la DDR4. En outre, les modules TSV 8H offrent de meilleures capacit\u00e9s de refroidissement selon Samsung. Concernant la tension, le dispositif respecte le standard de 1,1 V et offre une efficacit\u00e9 \u00e9nerg\u00e9tique accrue de 30\u00a0%.<\/p>\n\n\n\n

Samsung lancera un SSD PCIe 5.0 au deuxi\u00e8me trimestre 2022<\/a><\/strong><\/p>\n\n\n\n

Le calendrier : une adoption massive de la DDR5 \u00e0 partir de 2023<\/h2>\n\n\n\n

La derni\u00e8re diapositive renseigne sur le calendrier pr\u00e9visionnel de Samsung. La soci\u00e9t\u00e9 pr\u00e9voit un d\u00e9but de la production de masse pour ce module de 512 Go en fin d\u2019ann\u00e9e. Naturellement, celui-ci se destine au secteur des centres de donn\u00e9es. Pour le plus grand public, les barrettes auront une capacit\u00e9 de 32 Go pour commencer, puis de 64 Go.<\/p>\n\n\n\n

D\u2019ailleurs, \u00e0 l’instar de PNY, qui a pr\u00e9sent\u00e9 sa premi\u00e8re barrette m\u00e9moire DDR5 la semaine derni\u00e8re, Samsung estime que l\u2019adoption massive de la DDR5 sur le march\u00e9 grand public n\u2019interviendra pas avant 2023 \/ 2024. Rappelons que la DDR5 doit pourtant \u00eatre inaugur\u00e9e dans quelques semaines maintenant, avec l\u2019arriv\u00e9e des processeurs Intel Alder Lake d\u00e8s cet automne. Du c\u00f4t\u00e9 d\u2019AMD, il faudra s\u00fbrement patienter jusqu\u2019au lancement des Ryzen sous architecture CPU Zen 4, lesquels ne sont pas attendus avant l\u2019ann\u00e9e prochaine.<\/p>\n\n\n\n

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De la DDR5 TSV 8H haute de seulement 1 mm, alors que la DDR4 TSV 4H mesure 1,2 mm.<\/p>","protected":false},"author":87,"featured_media":679203,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"ep_exclude_from_search":false,"footnotes":""},"categories":[487,4075,4110],"tags":[514],"hubs":[],"acf":{"display_mode":"medium-img","post_show_excerpt":true,"post_source":"","hide_sidebar":false,"hide_advertising":false},"yoast_head":"\nSamsung d\u00e9taille son module m\u00e9moire DDR5-7200 de 512 Go<\/title>\n<meta name=\"description\" content=\"De la DDR5 TSV 8H haute de seulement 1 mm, alors que la DDR4 TSV 4H mesure 1,2 mm.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.tomshardware.fr\/samsung-detaille-son-module-memoire-ddr5-7200-de-512-go\/\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" 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