{"id":878945,"date":"2024-02-01T14:09:38","date_gmt":"2024-02-01T13:09:38","guid":{"rendered":"https:\/\/www.tomshardware.fr\/?p=878945"},"modified":"2024-02-02T14:59:32","modified_gmt":"2024-02-02T13:59:32","slug":"nvidia-va-faire-appel-a-intel-pour-graver-certains-de-ses-accelerateurs-dia","status":"publish","type":"post","link":"https:\/\/www.tomshardware.fr\/nvidia-va-faire-appel-a-intel-pour-graver-certains-de-ses-accelerateurs-dia\/","title":{"rendered":"NVIDIA va faire appel \u00e0 Intel pour graver certains de ses acc\u00e9l\u00e9rateurs d’IA"},"content":{"rendered":"\n
\"intel
\u00a9Intel<\/figcaption><\/figure>\n\n\n\n

NVIDIA semble avoir jet\u00e9 son d\u00e9volu sur Intel<\/strong> pour accro\u00eetre la capacit\u00e9 de production de ses puces acc\u00e9l\u00e9ratrices d’IA, actuellement exclusivement grav\u00e9es par TSMC. Une capacit\u00e9 de production mensuelle de 5000 wafers<\/em><\/strong> <\/em>aurait \u00e9t\u00e9 r\u00e9serv\u00e9e, soit approximativement 10% de ses besoins.<\/p>\n\n\n\n

Intel se limiterait toutefois uniquement au traitement de l’emballage des puces<\/strong>, laissant la production effective des GPU entre les mains d’autres industriels. Le partenariat entre les deux g\u00e9ants ne remet donc pas en cause la position actuelle de TSMC en tant que partenaire principal. Le fondeur continuera \u00e0 fabriquer la tr\u00e8s grande majorit\u00e9 des processeurs de NVIDIA, dont ceux de nouvelle g\u00e9n\u00e9ration tels que les GPU Hopper H200 d\u00e9di\u00e9s \u00e0 l’IA<\/a>.<\/p>\n\n\n\n

Forevos et CoWoS-S : des technologies d’emballage diff\u00e9rentes<\/h2>\n\n\n\n

Cette initiative repr\u00e9sente toutefois un d\u00e9fi de taille pour NVIDIA : tous les produits en question reposent sur le proc\u00e9d\u00e9 CoWoS-S (chip-on-wafer-on-substrate<\/em>) de TSMC, utilisant un interposer <\/em>en silicium a priori<\/em> grav\u00e9 en 65nm. Or, la technologie d’emballage avanc\u00e9e d’Intel, appel\u00e9e Foveros<\/a><\/strong>, repose \u00e9galement sur un interposer<\/em>, mais celui-ci est diff\u00e9rent, en particulier au niveau de la gravure (Intel 22FFL). Pour int\u00e9grer Foveros, NVIDIA devra donc pr\u00e9alablement valider cette technologie<\/strong> et s’attendre \u00e0 ce que les caract\u00e9ristiques des puces soient l\u00e9g\u00e8rement diff\u00e9rentes<\/strong> de celles produites par TSMC.<\/p>\n\n\n\n

Foveros est d\u00e9j\u00e0 utilis\u00e9 par Intel dans ses processeurs Core Ultra “Meteor Lake”<\/a> pour empiler les unit\u00e9s de calcul et les tuiles tGPU sur la puce de base. Le fondeur a d’ailleurs r\u00e9cemment inaugur\u00e9 Fab 9, sa premi\u00e8re usine d\u00e9di\u00e9e aux solutions avanc\u00e9es d’emballage<\/strong> de semi-conducteurs, incluant donc le packaging Foveros.<\/p>\n\n\n\n

Cette d\u00e9marche strat\u00e9gique intervient dans un contexte o\u00f9 la demande croissante en mati\u00e8re de puces acc\u00e9l\u00e9ratrices d’IA cr\u00e9e une pression significative sur la capacit\u00e9 de production existante, poussant les acteurs majeurs \u00e0 explorer des solutions alternatives pour satisfaire cette demande insatiable. Face \u00e0 la pression d’une demande croissante, NVIDIA semble donc opter pour une approche proactive<\/strong> en s\u00e9curisant une capacit\u00e9 suppl\u00e9mentaire<\/strong> gr\u00e2ce \u00e0 la collaboration avec Intel.<\/p>\n\n\n\n

Source : Wccftech<\/a><\/em><\/p>\n","protected":false},"excerpt":{"rendered":"

Alors que des acteurs majeurs tels que TSMC sont confront\u00e9s \u00e0 d'\u00e9normes contraintes d'approvisionnement, NVIDIA pourrait se tourner vers Intel pour r\u00e9pondre \u00e0 sa demande en mati\u00e8re de technologies d'emballage avanc\u00e9es de puces.<\/p>","protected":false},"author":9,"featured_media":878992,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"ep_exclude_from_search":false,"footnotes":""},"categories":[4107],"tags":[493,538],"hubs":[],"acf":{"display_mode":"medium-img","post_show_excerpt":true,"post_show_in_home":true,"post_show_summary":false,"post_source":"","hide_sidebar":false,"hide_advertising":false,"custom_ga_words":""},"yoast_head":"\nNVIDIA va faire appel \u00e0 Intel pour graver certains de ses acc\u00e9l\u00e9rateurs d'IA<\/title>\n<meta name=\"description\" content=\"Alors que des acteurs majeurs tels que TSMC sont confront\u00e9s \u00e0 d'\u00e9normes contraintes 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Je suis bloqu\u00e9 au XXi\u00e8me si\u00e8cle c\u00f4t\u00e9 gaming : Doom et Duke Nukem 3D, tous les autres ne sont qu'erstaz.","sameAs":["https:\/\/www.facebook.com\/3pi141592653589793","https:\/\/www.linkedin.com\/in\/cgs3141592653589793\/","https:\/\/x.com\/___CgS___","https:\/\/fr.wikipedia.org\/wiki\/Utilisateur:Cgsyannick"],"url":"https:\/\/www.tomshardware.fr\/author\/yannick-guerrini\/"}]}},"_links":{"self":[{"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/posts\/878945"}],"collection":[{"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/users\/9"}],"replies":[{"embeddable":true,"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/comments?post=878945"}],"version-history":[{"count":0,"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/posts\/878945\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/media\/878992"}],"wp:attachment":[{"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/media?parent=878945"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/categories?post=878945"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/tags?post=878945"},{"taxonomy":"hubs","embeddable":true,"href":"https:\/\/www.tomshardware.fr\/wp-json\/wp\/v2\/hubs?post=878945"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}